NTD24N06-001【PDF 1/8 页】MOSFET N-CH 60V 24A IPAK

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Sheet目录486

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NTD24N06

Power MOSFET

60 Volt, 24 Amp

N?Channel DPAK

Designed for low voltage, high speed switching applications in

power supplies, converters and power motor controls and bridge

http://onsemi.com

circuits.

Features

V (BR)DSS

60 V

R DS(on) TYP

32 m W

I D MAX

24 A

? Pb?Free Packages are Available

N?Channel

Typical Applications

Power Supplies

Converters

Power Motor Controls

Bridge Circuits

MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)

Rating

Drain?to?Source Voltage

Symbol

V DSS

Value

Unit

Vdc

MARKING DIAGRAMS

& PIN ASSIGNMENTS

Drain?to?Gate Voltage (R GS = 10 M W )

Gate?to?Source Voltage

? Continuous

? Non?repetitive (t p v 10 ms)

V DGR

V GS

" 20

" 30

Vdc

1 2

Drain

Drain Current

? Continuous @ T A = 25 ° C, T J = 150 ° C

? Continuous @ T A = 25 ° C, T J = 175 ° C

? Continuous @ T A = 100 ° C, T J = 175 ° C

? Single Pulse (t p v 10 m s), T J = 175 ° C

Total Power Dissipation @ T A = 25 ° C

Derate above 25 ° C

Total Power Dissipation @ T A = 25 ° C (Note 1)

Total Power Dissipation @ T A = 25 ° C (Note 2)

I D

I DM

P D

62.5

0.42

1.88

1.36

Adc

Apk

W/ ° C

DPAK

CASE 369C

(Surface Mount)

STYLE 2

Gate

Drain

Source

Operating and Storage Temperature Range

Single Pulse Drain?to?Source Avalanche

Energy ? Starting T J = 25 ° C

(V DD = 50 Vdc, V GS = 10 Vdc,

L = 1.0 mH, I L (pk) = 18 A, V DS = 60 Vdc)

Thermal Resistance

? Junction?to?Case

? Junction?to?Ambient (Note 1)

? Junction?to?Ambient (Note 2)

Maximum Lead Temperature for Soldering

Purposes, 1/8 in from case for 10 seconds

T J , T stg

E AS

R q JC

R q JA

T L

?55 to

+175

162

2.4

110

260

° C

° C/W

° C

DPAK

CASE 369D

(Straight Lead)

STYLE 2

24N06

1 2 3

Gate Drain Source

= Year

= Work Week

= Device Code

= Pb?Free Package

Maximum ratings are those values beyond which device damage can occur.

Maximum ratings applied to the device are individual stress limit values (not

normal operating conditions) and are not valid simultaneously. If these limits are

exceeded, device functional operation is not implied, damage may occur and

reliability may be affected.

1. When surface mounted to an FR?4 board using the 0.5 sq in drain pad size.

2. When surface mounted to an FR?4 board using the minimum recommended

pad size.

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 2 of this data sheet.

? Semiconductor Components Industries, LLC, 2005

August, 2005 ? Rev. 4

Publication Order Number:

NTD24N06/D

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